Loongson Technology has recently verified the prototype of its 32-core 3D5000 processor.

LS3D5000 is a 32-core CPU product for servers that packages two 3C5000 silicon dies together by using the Chiplet technology. The processor comes with 32 LA464 cores and 64MB of on-chip shared cache and supports eight-channel DDR4-3200 ECC memory. It has five high-speed HyperTransport interfaces to connect I/O expansion bridge chips, making it possible to build a single/dual/quad-socket server system with up to 128 cores. The chip also integrates a trusted platform module (TPM).

The LS3D5000, measuring 75.4×58.5×6.5mm, is packaged in a LGA-4129 socket. Its cores can run at 2.0GHz and above, with a typical power consumption of 130W at 2.0GHz or 170W at 2.2GHz and a TDP of no more than 300W at 2.2GHz. The measured scores of SPEC CPU2006 Base for single and dual-socket servers exceed 400 and 800 points, respectively, while quad-socket servers are expected to reach a score of 1,600 points.